{"id":14902,"date":"2021-06-14T00:00:00","date_gmt":"2021-06-13T23:00:00","guid":{"rendered":"https:\/\/www.sylex.sk\/palubna-optika-ako-je-pripojena-k-vonkajsiemu-svetu\/"},"modified":"2025-01-31T08:45:52","modified_gmt":"2025-01-31T07:45:52","slug":"palubna-optika-ako-je-pripojena-k-vonkajsiemu-svetu","status":"publish","type":"post","link":"https:\/\/www.sylex.sk\/sk\/palubna-optika-ako-je-pripojena-k-vonkajsiemu-svetu\/","title":{"rendered":"Palubn\u00e1 optika – ako je pripojen\u00e1 k vonkaj\u0161iemu svetu"},"content":{"rendered":"\t\t
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Vl\u00e1kna s\u00fa \u010doraz bli\u017e\u0161ie k \u010dipovej s\u00faprave. Jedn\u00fdm z hlavn\u00fdch cie\u013eov projektantov architekt\u00fary je privies\u0165 \u00fadaje pomocou svetla do bodu, v ktorom sa centr\u00e1lne sprac\u00favaj\u00fa. Ak\u00e9 s\u00fa v s\u00fa\u010dasnosti mo\u017enosti? Ktor\u00e9 typy m\u00e9di\u00ed s\u00fa k dispoz\u00edcii? Na \u010do sa treba zamera\u0165 pri h\u013eadan\u00ed rie\u0161enia prepojenia? V tomto \u010dl\u00e1nku n\u00e1jdete odpovede na tieto ot\u00e1zky.<\/span><\/p>\n

Pokrok v oblasti implement\u00e1cie optiky do elektroniky jasne poukazuje na trend zmen\u0161ovania vzdialenosti medzi optickou a elektrickou \u010das\u0165ou na akt\u00edvnej doske plo\u0161n\u00fdch spojov. Existuje tendencia dosta\u0165 optick\u00fa \u010das\u0165 na rovnak\u00fa \u00farove\u0148 ako umiestnenie SoC (System on Chip) – vytvori\u0165 jednu kompletn\u00fa \u010das\u0165. Na obr\u00e1zku \u010d. 1 je zn\u00e1zornen\u00e1 gen\u00e9za tohto v\u00fdvoja. S\u00fa\u010dasn\u00e9 popredn\u00e9 a \u0161tandardn\u00e9 rie\u0161enie je zalo\u017een\u00e9 na pr\u00edstupe z\u00e1suvn\u00fdch modulov. Tieto moduly sa nach\u00e1dzaj\u00fa na hranici vn\u00fatorn\u00e9ho a vonkaj\u0161ieho ekosyst\u00e9mu. T\u00fdmto sp\u00f4sobom sa doslova rozde\u013euje optick\u00e1 a elektrick\u00e1 \u010das\u0165. Hlavn\u00fdmi nev\u00fdhodami tohto rie\u0161enia s\u00fa v\u00e4\u010d\u0161ie rozmery, ni\u017e\u0161ia hustota mo\u017en\u00fdch pripojen\u00ed, n\u00e1ro\u010dn\u00e1 spotreba energie a chladenie. Druh\u00fa gener\u00e1ciu predstavuj\u00fa moduly OBO (On-Board Optics), v ktor\u00fdch je optoelektrick\u00fd meni\u010d u\u017e na \u00farovni dosky plo\u0161n\u00fdch spojov, ale st\u00e1le ako samostatn\u00e1 \u010das\u0165. Plne implementovan\u00fa optick\u00fa \u010das\u0165, zn\u00e1mu ako co-packed rie\u0161enie, bude pokr\u00fdva\u0165 3. gener\u00e1cia, ktor\u00e1 je st\u00e1le vo f\u00e1ze fin\u00e1lneho v\u00fdvoja.

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Rozhrania<\/span><\/strong><\/p>\n

Nov\u00fdm trendom je pr\u00edstup palubnej optiky. Typick\u00fdmi predstavite\u013emi s\u00fa rie\u0161enia ako Firefly (SAMTEC), BOA (II-IV), MiniPod a MicroPod (BROADCOM), LightAble (REFLEX Photonics), Leap (Amphenol), ako aj n\u00e1vrhy pripojenia Intel a TE. Ka\u017ed\u00e1 z t\u00fdchto spolo\u010dnost\u00ed m\u00e1 svoj vlastn\u00fd dizajn pripojenia OBO k optick\u00fdm vl\u00e1knam. Vprinc\u00edpe s\u00fa dve znich:
<\/span>– <\/span>Optick\u00e9 vl\u00e1kna s\u00fa pripojen\u00e9 priamo do modulu OBO (po\u010das v\u00fdrobn\u00e9ho procesu) bez mo\u017enosti odpojenia.
<\/span>– <\/span>Optick\u00e9 vl\u00e1kna s\u00fa ukon\u010den\u00e9 v rozhran\u00ed, ktor\u00e9 umo\u017e\u0148uje viacn\u00e1sobn\u00e9 cykly p\u00e1rovania a odp\u00e1rovania.<\/span><\/p>\n


Druh\u00e1 mo\u017enos\u0165 vyu\u017e\u00edva bu\u010f \u0161tandardn\u00e9 mutlifibre MT ferule (pou\u017e\u00edvan\u00e9 v konektoroch MPO \/MTP\u00ae), alebo \u0161peci\u00e1lne ferule navrhnut\u00e9 a ur\u010den\u00e9 na tento \u00fa\u010del. MT pr\u00edstup vyu\u017e\u00edva princ\u00edp fyzik\u00e1lneho kontaktu, zatia\u013e \u010do \u0161peci\u00e1lne kovania s\u00fa zalo\u017een\u00e9 na princ\u00edpe \u0161o\u0161oviek (<\/span>napr\u00edklad Prizm\u00ae LightTurn\u00ae od spolo\u010dnosti USConec)<\/span>. Na obr\u00e1zku \u010d. 2 s\u00fa zn\u00e1zornen\u00e9 niektor\u00e9 pr\u00edklady modulov OBO a ich optick\u00fdch rozhran\u00ed.

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Rovnako d\u00f4le\u017eit\u00fdm aspektom je sp\u00f4sob pripojenia modulu OBO k samotnej doske plo\u0161n\u00fdch spojov. Naj\u010dastej\u0161ie pou\u017e\u00edvan\u00fdm pr\u00edstupom je trval\u00e9 sp\u00e1jkovan\u00e9 pripojenie OBO k doske plo\u0161n\u00fdch spojov, av\u0161ak napr\u00edklad rie\u0161enie Samtec je navrhnut\u00e9 na viacn\u00e1sobn\u00e9 pripojenie v\u010faka \u0161peci\u00e1lnym elektrick\u00fdm konektorom s vysokou hustotou na palube. Na prepojenie OBO s vonkaj\u0161\u00edm prostred\u00edm sa pou\u017e\u00edvaj\u00fa r\u00f4zne typy optick\u00fdch konektorov v z\u00e1vislosti od individu\u00e1lnych po\u017eiadaviek cel\u00e9ho syst\u00e9mu. Vzh\u013eadom na po\u017eiadavky na vysok\u00fa \u0161\u00edrku p\u00e1sma a prenosov\u00fa kapacitu sa naj\u010dastej\u0161ie pou\u017e\u00edvaj\u00fa viacvl\u00e1knov\u00e9 konektory. <\/span><\/p>\n

MPO\/MTP\u00ae <\/span><\/a>konektor – optick\u00e9 vl\u00e1kna s\u00fa zakon\u010den\u00e9 do termoplastickej obj\u00edmky. \u010celn\u00e1 strana kovania a vl\u00e1kna s\u00fa vyle\u0161ten\u00e9 na vysokej \u00farovni \u010distoty a kvality. Sp\u00e1jan\u00e9 vl\u00e1kna v tomto type konektora vytv\u00e1raj\u00fa fyzick\u00fd kontakt. V\u010faka tomuto fyzick\u00e9mu kontaktu je zaisten\u00e1 najvy\u0161\u0161ia kvalita optick\u00e9ho pripojenia. <\/span><\/p>\n

MXC\u00ae <\/span><\/a>konektor – v tomto pr\u00edpade sa optick\u00fd sign\u00e1l pren\u00e1\u0161a medzi konektormi vo zv\u00e4\u010d\u0161enom svetelnom l\u00fa\u010di s v\u00e4\u010d\u0161\u00edm vonkaj\u0161\u00edm priemerom ako samotn\u00e9 jadro vl\u00e1kna. To sa dosahuje pomocou \u0161o\u0161oviek, ktor\u00e9 menia priemer sveteln\u00e9ho l\u00fa\u010da a s\u00fa zodpovedn\u00e9 za zaostrenie sign\u00e1lu sp\u00e4\u0165 do jadra vl\u00e1kna. Tento typ pripojenia je menej citliv\u00fd na prach a ne\u010distoty, preto\u017ee sveteln\u00fd l\u00fa\u010d m\u00e1 naozaj ve\u013ek\u00fd bod. Na druhej strane s\u00fa celkov\u00e9 optick\u00e9 straty vy\u0161\u0161ie v porovnan\u00ed s pripojeniami zalo\u017een\u00fdmi na MPO. <\/span><\/p>\n

Str\u00e1nka <\/span>VSFF <\/span> <\/a>(Very small form factor) predstavuje najnov\u0161iu gener\u00e1ciu jednovl\u00e1knov\u00fdch konektorov, ktor\u00e9 sa vyzna\u010duj\u00fa ve\u013emi vysokou hustotou vl\u00e1kien v pomere k ploche konektora. Je zalo\u017een\u00fd na vyspelej technike ukon\u010dovania vl\u00e1kien pomocou 1,25 mm keramickej koncovky. Tento konektor umo\u017e\u0148uje a\u017e trojn\u00e1sobn\u00fa hustotu vl\u00e1kien v porovnan\u00ed s tradi\u010dn\u00fdm konektorom LC mal\u00e9ho form\u00e1tu a pova\u017euje sa za najpravdepodobnej\u0161ieho kandid\u00e1ta pre aplik\u00e1cie na b\u00e1ze QSFP DD a SFP DD.<\/span><\/p>\n

MIL\/AEROSPACE <\/span><\/a>je rodina konektorov, ktor\u00e1 sa pou\u017e\u00edva v aplik\u00e1ci\u00e1ch so \u0161pecifick\u00fdmi po\u017eiadavkami na prostredie. Typick\u00fdmi predstavite\u013emi s\u00fa M29504 a
Rozhrania na b\u00e1ze termin\u00e1lov ARINC 801.<\/span><\/p>\n


T<\/span>e pripojenie m\u00e9di\u00ed<\/span><\/strong><\/p>\n

Oba body pripojenia, tak na strane OBO, ako aj na strane vonkaj\u0161ieho prostredia, s\u00fa prepojen\u00e9 optick\u00fdmi vl\u00e1knami. V praxi sa pou\u017e\u00edvaj\u00fa dve z\u00e1kladn\u00e9 kon\u0161trukcie tohto m\u00e9dia. Prv\u00fdm je okr\u00fahly k\u00e1bel s ochrann\u00fdm vonkaj\u0161\u00edm pl\u00e1\u0161\u0165om, ktor\u00fd m\u00f4\u017ee obsahova\u0165 aj pevnostn\u00fd prvok na b\u00e1ze kevlaru. V\u00fdhodou tejto kon\u0161trukcie je vo\u013enos\u0165 manipul\u00e1cie, najm\u00e4 pri zlo\u017eitej\u0161\u00edch tras\u00e1ch, kde je spojovacie m\u00e9dium vystaven\u00e9 viacer\u00fdm ohybom. Nev\u00fdhodou s\u00fa v\u00e4\u010d\u0161ie priestorov\u00e9 n\u00e1roky a ch\u00fdbaj\u00faca mo\u017enos\u0165 stohovania, ke\u010f je na doske plo\u0161n\u00fdch spojov v jednom rade viac modulov OBO. Tieto nev\u00fdhody s\u00fa vyrie\u0161en\u00e9 pou\u017eit\u00edm druhej kon\u0161trukcie – p\u00e1skov\u00e9ho k\u00e1bla, ktor\u00fd m\u00e1 tov\u00e1rensky vyroben\u00fa a presn\u00fa geometriu, tvar a rozmery, \u010do s\u00fa skuto\u010dn\u00e9 v\u00fdhody pri procese ukon\u010dovania. Zmen\u0161en\u00e9 rozmery s\u00fa ide\u00e1lne aj pre funkciu stohovania na doske plo\u0161n\u00fdch spojov.<\/span><\/p>\n

Vzh\u013eadom na \u0161pecifick\u00e9 pou\u017eitie m\u00e9di\u00ed na pripojenie je d\u00f4le\u017eit\u00e9 zv\u00e1\u017ei\u0165 nieko\u013eko bodov po\u010das:
– f\u00e1za n\u00e1vrhu <\/span>– ke\u010f sa vyberie m\u00e9dium
– v\u00fdroba <\/span>– ke\u010f je ukon\u010den\u00e1
– kone\u010dn\u00e9 <\/span>pou\u017eitie – ke\u010f je m\u00e9dium pripojen\u00e9 k re\u00e1lnej aplik\u00e1cii<\/span><\/p>\n

Ako bolo uveden\u00e9 na za\u010diatku tohto \u010dl\u00e1nku, cie\u013eom je \u010do najviac pribl\u00ed\u017ei\u0165 vl\u00e1kno k SoC. To znamen\u00e1, \u017ee vzdialenosti, na ktor\u00fdch sa realizuj\u00fa skuto\u010dn\u00e9 optick\u00e9 pripojenia, musia by\u0165 \u010do najkrat\u0161ie v porovnan\u00ed s typick\u00fdmi zv\u00e4zkami pou\u017e\u00edvan\u00fdmi na pripojenie modulov QSFP alebo SFP. Z tohto d\u00f4vodu s\u00fa na presnos\u0165 kone\u010dnej d\u013a\u017eky kladen\u00e9 pr\u00edsnej\u0161ie po\u017eiadavky, preto\u017ee vo vn\u00fatri zariadenia nie je priestor na vo\u013en\u00e9 vl\u00e1kna. Modul OBO a rozhranie vonkaj\u0161ieho prostredia maj\u00fa presne definovan\u00fa polohu. Preto je pr\u00edpustn\u00e1 tolerancia d\u013a\u017eky postroja len nieko\u013eko milimetrov. Je d\u00f4le\u017eit\u00e9 nastavi\u0165 kontrolu krit\u00e9ri\u00ed kvality tak, aby sp\u013a\u0148ala t\u00fato n\u00e1ro\u010dn\u00fa po\u017eiadavku. Dod\u00e1vate\u013e tak\u00e9hoto zv\u00e4zku mus\u00ed venova\u0165 ve\u013ek\u00fa pozornos\u0165 v\u00fd\u0165a\u017enosti kvality v\u00fdrobn\u00e9ho procesu, aby udr\u017eal mieru zmetkov\/prepracovania na primeranej kvalitat\u00edvnej \u00farovni, ktor\u00e1 nem\u00e1 vplyv na kone\u010dn\u00fa cenu v\u00fdrobku. <\/span><\/p>\n

Typick\u00fdm prepojovac\u00edm m\u00e9diom je p\u00e1skov\u00fd typ k\u00e1bla s v\u00fd\u0161kou iba 250um a \u0161\u00edrkou zodpovedaj\u00facou po\u010dtu vl\u00e1kien a priemeru vl\u00e1kna. P\u00e1sky so \u0161pecifickou schopnos\u0165ou rozdeli\u0165 k\u00e1bel na jednotliv\u00e9 vl\u00e1kna sa naz\u00fdvaj\u00fa PEELABLE ribbons. Tie, ktor\u00e9 s\u00fa neoddelite\u013en\u00e9, s\u00fa NEODDELITE\u013dN\u00c9. NEVODI\u010cOV\u00c9 typy s\u00fa ur\u010den\u00e9 pre aplik\u00e1cie, kde s\u00fa obe strany zv\u00e4zku ukon\u010den\u00e9 viacvl\u00e1knov\u00fdmi konektormi a nie je medzi nimi potrebn\u00e9 \u017eiadne \u0161peci\u00e1lne zapojenie. T\u00e1to verzia je mimoriadne mechanicky stabiln\u00e1 a existuje len zanedbate\u013en\u00e1 pravdepodobnos\u0165, \u017ee by sa vl\u00e1kna po\u010das ukon\u010dovania alebo in\u0161tal\u00e1cie oddelili. <\/span><\/p>\n

Verzia PEELABLE je vhodn\u00e1 pre hybridn\u00e9 zv\u00e4zky s viacvl\u00e1knov\u00fdm typom konektora na jednej strane (pripojen\u00fdm k modulu OBO) a jednovl\u00e1knov\u00fdmi konektormi (MDC, MIL\/AERO) alebo \u0161peci\u00e1lnym dr\u00f4tov\u00fdm viacvl\u00e1knov\u00fdm konektorom na druhej strane. Je d\u00f4le\u017eit\u00e9 informova\u0165 z\u00e1kazn\u00edka o type pou\u017eitej p\u00e1sky; okrem r\u00f4znych sp\u00f4sobov pou\u017eitia konektorov je potrebn\u00e9 zv\u00e1\u017ei\u0165 aj \u010fal\u0161ie kritick\u00e9 body. <\/span><\/p>\n

V pr\u00edpade, \u017ee sa o\u010dak\u00e1va viacn\u00e1sobn\u00e9 oh\u00fdbanie m\u00e9di\u00ed alebo sa vy\u017eaduje zv\u00fd\u0161en\u00e1 ochrana vl\u00e1kien, mal by sa pou\u017ei\u0165 in\u00fd typ k\u00e1bla. Dobr\u00fdm kandid\u00e1tom je verzia s mal\u00fdm okr\u00fahlym pl\u00e1\u0161\u0165om (s priemerom 2,0 alebo 3,0 mm) bu\u010f s kevlarov\u00fdm pevnostn\u00fdm prvkom, alebo bez neho. Pri pou\u017e\u00edvan\u00ed tohto k\u00e1bla je potrebn\u00e9 zv\u00e1\u017ei\u0165 postup ribboniz\u00e1cie, ktor\u00fd zmen\u00ed \u0161trukt\u00faru vo\u013en\u00e9ho vl\u00e1kna na \u0161trukt\u00faru p\u00e1sky, ktor\u00e1 je potrebn\u00e1 na proces ukon\u010denia viacer\u00fdch vl\u00e1kien. <\/span><\/p>\n

Po v\u00fdbere m\u00e9di\u00ed a konektorov je mo\u017en\u00e9 vyrobi\u0165 samotn\u00fd zv\u00e4zok. Existuj\u00fa dva z\u00e1kladn\u00e9 typy: PIGTAILED a CONNECTORIZED (pozri
obr\u00e1zok 3). V prvom pr\u00edpade je modul OBO priamo pripojen\u00fd k optick\u00fdm vl\u00e1knam. Druh\u00e1 mo\u017enos\u0165 vyu\u017e\u00edva funkciu \u0161peci\u00e1lnej obj\u00edmky, ktor\u00e1 je k modulu OBO pripojen\u00e1 zvonku. Tento pr\u00edstup pon\u00faka vy\u0161\u0161iu flexibilitu najm\u00e4 pri manipul\u00e1cii s modulom OBO, preto\u017ee doch\u00e1dza k minim\u00e1lnemu po\u0161kodeniu m\u00e9di\u00ed a modul a d\u013a\u017eka kone\u010dn\u00e9ho produktu sa m\u00f4\u017ee l\u00ed\u0161i\u0165 len d\u013a\u017ekou spojovacieho zv\u00e4zku.

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\u010eal\u0161\u00edm d\u00f4le\u017eit\u00fdm parametrom pou\u017eit\u00e9ho m\u00e9dia je jeho mechanick\u00e1 stabilita. K\u00e1ble s\u00fa niekedy priamo zakon\u010den\u00e9 do OBO a predstavuj\u00fa podstatn\u00fa \u010das\u0165 modulu. Je ve\u013emi d\u00f4le\u017eit\u00e9 zabezpe\u010di\u0165, aby manipul\u00e1cia s modulom\/in\u0161tal\u00e1cia nesp\u00f4sobila \u017eiadny vplyv na vl\u00e1kna, ktor\u00fd by mohol vies\u0165 k poruche samotn\u00e9ho modulu. Ak sa pou\u017eije NEDOT\u00ddKAJ\u00daCA sa p\u00e1ska, probl\u00e9m je zanedbate\u013en\u00fd, preto\u017ee kon\u0161trukcia p\u00e1sky poskytuje potrebn\u00fa ochranu. Ukon\u010denie verzie PEELABLE mus\u00ed by\u0165 nastaven\u00e9 tak, aby si p\u00e1ska zachovala svoju celistvos\u0165 a po in\u0161tal\u00e1cii modulu sa neoddelila. Oddelenie p\u00e1sky vedie k vyradeniu cel\u00e9ho modulu, \u010do je ove\u013ea drah\u0161ie ako samotn\u00fd nespracovan\u00fd k\u00e1bel. Aby sa predi\u0161lo takejto situ\u00e1cii na strane z\u00e1kazn\u00edka, je nevyhnutn\u00e9 vyhodnoti\u0165 kombin\u00e1ciu modul + k\u00e1bel pod\u013ea normy Telcordia GR468, ktor\u00e1 definuje v\u0161eobecn\u00e9 po\u017eiadavky na zabezpe\u010denie spo\u013eahlivosti optoelektronick\u00fdch zariaden\u00ed. Z h\u013eadiska optick\u00e9ho zv\u00e4zku je jedn\u00fdm z najd\u00f4le\u017eitej\u0161\u00edch aspektov definovanie mechanickej integrity pou\u017eit\u00e9ho m\u00e9dia – k\u00e1bla. Je potrebn\u00e9 spomen\u00fa\u0165, \u017ee norma Telcordia GR20 pre spo\u013eahlivos\u0165 nespracovan\u00fdch k\u00e1blov m\u00e1 in\u00e9 \u00farovne akcepta\u010dn\u00fdch krit\u00e9ri\u00ed ako Telcordia GR468, a preto sa nesta\u010d\u00ed spolieha\u0165 len na inform\u00e1cie od v\u00fdrobcu k\u00e1bla. Aj tento bod by mal by\u0165 na kontrolnom zozname, ke\u010f je n\u00e1vrh syst\u00e9mu v \u0161t\u00e1diu v\u00fdvoja.<\/span><\/p>\n


Obavy t\u00fdkaj\u00face sa parametrov<\/span><\/strong><\/p>\n

Ako u\u017e bolo uveden\u00e9, optick\u00e9 rozhranie na strane OBO a na strane \u010delnej dosky m\u00f4\u017ee by\u0165 zalo\u017een\u00e9 na r\u00f4znych materi\u00e1loch\/rie\u0161eniach. V z\u00e1sade existuj\u00fa tri z\u00e1kladn\u00e9 typy:
1. Keramick\u00e1 obj\u00edmka – pou\u017e\u00edva sa v jednovl\u00e1knov\u00fdch optick\u00fdch konektoroch. T\u00e1to kon\u0161trukcia zaru\u010duje skuto\u010dn\u00fd fyzick\u00fd kontakt medzi dvoma sp\u00e1rovan\u00fdmi vl\u00e1knami.
2. Obd\u013a\u017enikov\u00e1 termoplastov\u00e1 obj\u00edmka – pou\u017e\u00edva sa vo viacvl\u00e1knov\u00fdch konektoroch (MPO, MTP\u00ae), ktor\u00e1 je tie\u017e ur\u010den\u00e1 na zabezpe\u010denie fyzick\u00e9ho kontaktu.
3. \u0160peci\u00e1lna termoplastick\u00e1 obj\u00edmka, ktor\u00e1 obsahuje s\u00fastavu \u0161o\u0161oviek. V tomto pr\u00edpade neexistuje skuto\u010dn\u00fd fyzick\u00fd kontakt medzi vl\u00e1knami a vy\u017earovan\u00e9 svetlo mus\u00ed prejs\u0165 dvoma zmenami prostredia (ferula-vzduch a vzduch-ferula).<\/span><\/p>\n

V\u00fdber rozhrania\/ferrule m\u00e1 priamy vplyv na najd\u00f4le\u017eitej\u0161\u00ed parameter optickej cesty – vlo\u017en\u00e9 straty.<\/span><\/p>\n

Pri pou\u017eit\u00ed prv\u00fdch dvoch vy\u0161\u0161ie uveden\u00fdch ferul\u00ed s re\u00e1lnym fyzick\u00fdm kontaktom medzi vl\u00e1knami s\u00fa hodnoty vlo\u017en\u00fdch str\u00e1t na \u00farovni 0,3 dB. Tak\u00e9to hodnoty s\u00fa typick\u00e9, priemyselne akceptovan\u00e9 a posta\u010duj\u00face pre v\u00e4\u010d\u0161inu aplik\u00e1ci\u00ed. In\u00e1 situ\u00e1cia nast\u00e1va v pr\u00edpade rozhrania zalo\u017een\u00e9ho na \u0161o\u0161ovk\u00e1ch. Hodnoty \u00fatlmu sa pohybuj\u00fa medzi 1,2 a 2,2 dB (v z\u00e1vislosti od kon\u0161trukcie). Pri projektoch, ktor\u00e9 s\u00fa citlivej\u0161ie na celkov\u00fd v\u00fdkonov\u00fd rozpo\u010det, mo\u017eno pou\u017ei\u0165 roz\u0161\u00edren\u00fd typ \u0161o\u0161ovkov\u00fdch koncoviek. Zv\u00fd\u0161enie geometrickej presnosti a nanesenie antireflexnej vrstvy na koncov\u00fa stranu koncovky zlep\u0161uje vlo\u017en\u00e9 straty a dosahuje \u00farove\u0148 0,6 – 1,0 dB. Z\u00e1kazn\u00edk si tak m\u00f4\u017ee vybra\u0165 najvhodnej\u0161iu verziu pre konkr\u00e9tnu aplik\u00e1ciu. Na obr\u00e1zku \u010d. 4 je zn\u00e1zornen\u00fd rozdiel v oblasti, ktor\u00e1 je vo fyzickom kontakte po\u010das p\u00e1rovania dvoch konektorov a m\u00e1 priamy vplyv na optick\u00e9 parametre.

<\/span><\/p>\n

\"\"<\/p>\n


Po\u010das procesu obstar\u00e1vania dod\u00e1vate\u013eov zv\u00e4zkov – najm\u00e4 t\u00fdch, ktor\u00ed pon\u00fakaj\u00fa v\u00fdrobky na b\u00e1ze \u0161o\u0161oviek – je nevyhnutn\u00e9 po\u017eiada\u0165 o potvrdenie pou\u017eit\u00e9ho postupu merania optick\u00fdch parametrov. Ke\u010f\u017ee rie\u0161enia zalo\u017een\u00e9 na \u0161o\u0161ovk\u00e1ch nie s\u00fa tradi\u010dn\u00e9, je d\u00f4le\u017eit\u00e9 zoh\u013eadni\u0165 nielen deklarovan\u00e9 maxim\u00e1lne hodnoty vlo\u017en\u00e9ho \u00fatlmu (ud\u00e1van\u00e9 v\u00fdrobcom ferule), ale aj kompletn\u00fa met\u00f3du merania. Vo v\u0161eobecnosti t\u00e1to met\u00f3da zah\u0155\u0148a \u0161tyri body:
1. Nastavenie meranej trasy – definovanie typu merania (\u00fatlm t\u00fdkaj\u00faci sa jednotliv\u00fdch sp\u00e1rovan\u00fdch rozhran\u00ed\/konektorov alebo cel\u00e9ho optick\u00e9ho kan\u00e1la).
2. Nastavenie nulovej \u00farovne pred skuto\u010dn\u00fdm meran\u00edm.
3. Skuto\u010dn\u00e9 meranie a \u00faprava hodn\u00f4t sp\u00f4soben\u00e1 Fresnelov\u00fdmi odrazmi.
4. Porovnanie nameran\u00fdch\/upraven\u00fdch hodn\u00f4t s hrani\u010dn\u00fdmi hodnotami vyhovuje\/nevyhovuje, ktor\u00e9 ud\u00e1va z\u00e1kazn\u00edk alebo v\u00fdrobca koncovky.<\/span><\/p>\n


V skratke<\/span><\/strong><\/p>\n

Zv\u00e4zky ur\u010den\u00e9 na prepojenie modulu OBO s vonkaj\u0161\u00edm prostred\u00edm sa m\u00f4\u017eu na prv\u00fd poh\u013ead zda\u0165 technicky jednoduch\u00e9. Napriek tomuto predpokladu je d\u00f4le\u017eit\u00e9 po\u010das defini\u010dnej \u010dasti projektu venova\u0165 dostato\u010dn\u00fa pozornos\u0165:
<\/span>– <\/span>Typ konektora\/rozhrania pou\u017e\u00edvan\u00e9ho na strane OBO a na hranici vonkaj\u0161ieho prostredia.
<\/span>– <\/span>kon\u0161trukcia pou\u017eit\u00e9ho prepojovacieho k\u00e1bla s d\u00f4razom na krit\u00e9ri\u00e1 kvality definovan\u00e9 medzin\u00e1rodn\u00fdmi normami.
<\/span>– <\/span>O\u010dak\u00e1van\u00e9 \u00farovne optick\u00fdch parametrov vzh\u013eadom na pou\u017eit\u00e9 nastavenie\/postupy merania. <\/span> <\/p>\n


Dodr\u017eiavanie t\u00fdchto z\u00e1kladn\u00fdch bodov v\u00e1m umo\u017en\u00ed zabezpe\u010di\u0165 bud\u00facu funk\u010dnos\u0165 aj t\u00fdch najsofistikovanej\u0161\u00edch produktov, ako s\u00fa napr. <\/span>mie\u0161a\u010dky<\/span>a predch\u00e1dza\u0165 pr\u00edpadn\u00fdm probl\u00e9mom s kvalitou, ktor\u00e9 by sa mohli objavi\u0165 po uveden\u00ed syst\u00e9mu do prev\u00e1dzky – ke\u010f u\u017e m\u00f4\u017ee by\u0165 neskoro. So spolo\u010dnos\u0165ou Sylex sa m\u00f4\u017eete spo\u013eahn\u00fa\u0165 na jednoduch\u00fa skuto\u010dnos\u0165 – urob\u00edme v\u0161etko pre to, aby sme identifikovali v\u0161etky potrebn\u00e9 vstupy a poskytli v\u00e1m dokonal\u00fd v\u00fdstup. <\/span><\/p>\n

Sylex je spolo\u010dnos\u0165, ktor\u00e1 p\u00f4sob\u00ed v odvetv\u00ed optick\u00fdch vl\u00e1kien od roku 1995 a pon\u00faka svoje sk\u00fasenosti a profesion\u00e1lny pr\u00edstup, aby bola t\u00fdm spr\u00e1vnym partnerom v pr\u00edpadoch, ke\u010f sa vy\u017eaduj\u00fa rie\u0161enia palubn\u00e9ho optick\u00e9ho prepojenia.<\/span>
<\/span>

Eduard Koza, <\/b>ved\u00faci v\u00fdskumu a v\u00fdvoja<\/b>, Kontakt<\/a><\/p>\n

Eduard Koza je mana\u017e\u00e9r v\u00fdskumu a v\u00fdvoja v spolo\u010dnosti Sylex. Za\u010d\u00ednal ako projektov\u00fd in\u017einier pre vysoko v\u00fdkonn\u00e9 meden\u00e9 zv\u00e4zky. V roku 2000 roz\u0161\u00edril svoje aktivity o pas\u00edvne produkty na prepojenie optick\u00fdch vl\u00e1kien a syst\u00e9my na sn\u00edmanie optick\u00fdch vl\u00e1kien. Na za\u010diatku tohto obdobia viedol najm\u00e4 viacer\u00e9 technologick\u00e9 transfery a zastre\u0161oval implement\u00e1ciu nov\u00fdch produktov do portf\u00f3lia spolo\u010dnosti.<\/span><\/p>\n


Nesk\u00f4r v spolo\u010dnosti zast\u00e1val funkciu mana\u017e\u00e9ra pre in\u017einierstvo a viedol technologick\u00e9 a in\u017einierske \u010dinnosti zodpovedn\u00e9 za prenos n\u00e1padov z\u00e1kazn\u00edkov do fin\u00e1lnych produktov. Jeho s\u00fa\u010dasn\u00e1 poz\u00edcia zah\u0155\u0148a riadenie novozaveden\u00fdch technick\u00fdch rie\u0161en\u00ed, pri\u010dom vyu\u017e\u00edva svoje poradensk\u00e9 schopnosti t\u00fdkaj\u00face sa prisp\u00f4soben\u00fdch produktov optick\u00fdch prepojen\u00ed.<\/span><\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

\n\t\t\t\t
\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\"\"\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t\t\t

Interfaces<\/span><\/strong><\/p>\n

The emerging trend is the On-Board Optics approach. Typical representatives are solutions such as Firefly (SAMTEC), BOA (II-IV), MiniPod and MicroPod (BROADCOM), LightAble (REFLEX Photonics), Leap (Amphenol), as well as Intel and TE connectivity designs. Each of those companies has its own design of OBO connectivity to the optical fibres. Inprinciple there are two of them:
<\/span>\u2022 <\/span>Optical fibres are directly connected into the OBO module (during the manufacturing process) without any possibility of disconnection.
<\/span>\u2022 <\/span>Optical fibres are terminated into the interface, which allows multiple mating and un-mating cycles.<\/span><\/p>\n


The second option uses either standard mutlifibre MT ferrules (used in MPO \/MTP\u00ae connectors) or special ferrules designed and dedicated for this purpose. The MT approach utilises the physical contact principle, whereas the special ferrules are based on the lens principle (<\/span>for example Prizm\u00ae LightTurn\u00ae from USConec)<\/span>. Figure No. 2 shows some examples of the OBO modules and their optical interfaces. <\/span><\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

\n\t\t\t\t
\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\"\"\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t\t\t

Rovnako d\u00f4le\u017eit\u00fdm aspektom je sp\u00f4sob pripojenia modulu OBO k samotnej doske plo\u0161n\u00fdch spojov. Naj\u010dastej\u0161ie pou\u017e\u00edvan\u00fdm pr\u00edstupom je trval\u00e9 sp\u00e1jkovan\u00e9 pripojenie OBO k doske plo\u0161n\u00fdch spojov, av\u0161ak napr\u00edklad rie\u0161enie Samtec je navrhnut\u00e9 na viacn\u00e1sobn\u00e9 pripojenie v\u010faka \u0161peci\u00e1lnym elektrick\u00fdm konektorom s vysokou hustotou na palube. Na prepojenie OBO s vonkaj\u0161\u00edm prostred\u00edm sa pou\u017e\u00edvaj\u00fa r\u00f4zne typy optick\u00fdch konektorov v z\u00e1vislosti od individu\u00e1lnych po\u017eiadaviek cel\u00e9ho syst\u00e9mu. Vzh\u013eadom na po\u017eiadavky na vysok\u00fa \u0161\u00edrku p\u00e1sma a prenosov\u00fa kapacitu sa naj\u010dastej\u0161ie pou\u017e\u00edvaj\u00fa viacvl\u00e1knov\u00e9 konektory. <\/span><\/p>\n

MPO\/MTP\u00ae <\/span><\/a>konektor – optick\u00e9 vl\u00e1kna s\u00fa zakon\u010den\u00e9 do termoplastickej obj\u00edmky. \u010celn\u00e1 strana kovania a vl\u00e1kna s\u00fa vyle\u0161ten\u00e9 na vysokej \u00farovni \u010distoty a kvality. Sp\u00e1jan\u00e9 vl\u00e1kna v tomto type konektora vytv\u00e1raj\u00fa fyzick\u00fd kontakt. V\u010faka tomuto fyzick\u00e9mu kontaktu je zaisten\u00e1 najvy\u0161\u0161ia kvalita optick\u00e9ho pripojenia. <\/span><\/p>\n

MXC\u00ae <\/span><\/a>konektor – v tomto pr\u00edpade sa optick\u00fd sign\u00e1l pren\u00e1\u0161a medzi konektormi vo zv\u00e4\u010d\u0161enom svetelnom l\u00fa\u010di s v\u00e4\u010d\u0161\u00edm vonkaj\u0161\u00edm priemerom ako samotn\u00e9 jadro vl\u00e1kna. To sa dosahuje pomocou \u0161o\u0161oviek, ktor\u00e9 menia priemer sveteln\u00e9ho l\u00fa\u010da a s\u00fa zodpovedn\u00e9 za zaostrenie sign\u00e1lu sp\u00e4\u0165 do jadra vl\u00e1kna. Tento typ pripojenia je menej citliv\u00fd na prach a ne\u010distoty, preto\u017ee sveteln\u00fd l\u00fa\u010d m\u00e1 naozaj ve\u013ek\u00fd bod. Na druhej strane s\u00fa celkov\u00e9 optick\u00e9 straty vy\u0161\u0161ie v porovnan\u00ed s pripojeniami zalo\u017een\u00fdmi na MPO. <\/span><\/p>\n

Str\u00e1nka <\/span>VSFF <\/span> <\/a>(Very small form factor) predstavuje najnov\u0161iu gener\u00e1ciu jednovl\u00e1knov\u00fdch konektorov, ktor\u00e9 sa vyzna\u010duj\u00fa ve\u013emi vysokou hustotou vl\u00e1kien v pomere k ploche konektora. Je zalo\u017een\u00fd na vyspelej technike ukon\u010dovania vl\u00e1kien pomocou 1,25 mm keramickej koncovky. Tento konektor umo\u017e\u0148uje a\u017e trojn\u00e1sobn\u00fa hustotu vl\u00e1kien v porovnan\u00ed s tradi\u010dn\u00fdm konektorom LC mal\u00e9ho form\u00e1tu a pova\u017euje sa za najpravdepodobnej\u0161ieho kandid\u00e1ta pre aplik\u00e1cie na b\u00e1ze QSFP DD a SFP DD.<\/span><\/p>\n

MIL\/AEROSPACE <\/span><\/a>je rodina konektorov, ktor\u00e1 sa pou\u017e\u00edva v aplik\u00e1ci\u00e1ch so \u0161pecifick\u00fdmi po\u017eiadavkami na prostredie. Typick\u00fdmi predstavite\u013emi s\u00fa rozhrania zalo\u017een\u00e9 na termin\u00e1loch M29504 a
ARINC 801.<\/span><\/p>\n


T<\/span>e pripojenie m\u00e9di\u00ed<\/span><\/strong><\/p>\n

Oba body pripojenia, tak na strane OBO, ako aj na strane vonkaj\u0161ieho prostredia, s\u00fa prepojen\u00e9 optick\u00fdmi vl\u00e1knami. V praxi sa pou\u017e\u00edvaj\u00fa dve z\u00e1kladn\u00e9 kon\u0161trukcie tohto m\u00e9dia. Prv\u00fdm je okr\u00fahly k\u00e1bel s ochrann\u00fdm vonkaj\u0161\u00edm pl\u00e1\u0161\u0165om, ktor\u00fd m\u00f4\u017ee obsahova\u0165 aj pevnostn\u00fd prvok na b\u00e1ze kevlaru. V\u00fdhodou tejto kon\u0161trukcie je vo\u013enos\u0165 manipul\u00e1cie, najm\u00e4 pri zlo\u017eitej\u0161\u00edch tras\u00e1ch, kde je spojovacie m\u00e9dium vystaven\u00e9 viacer\u00fdm ohybom. Nev\u00fdhodou s\u00fa v\u00e4\u010d\u0161ie priestorov\u00e9 n\u00e1roky a ch\u00fdbaj\u00faca mo\u017enos\u0165 stohovania, ke\u010f je na doske plo\u0161n\u00fdch spojov v jednom rade viac modulov OBO. Tieto nev\u00fdhody s\u00fa vyrie\u0161en\u00e9 pou\u017eit\u00edm druhej kon\u0161trukcie – p\u00e1skov\u00e9ho k\u00e1bla, ktor\u00fd m\u00e1 tov\u00e1rensky vyroben\u00fa a presn\u00fa geometriu, tvar a rozmery, \u010do s\u00fa skuto\u010dn\u00e9 v\u00fdhody pri procese ukon\u010dovania. Zmen\u0161en\u00e9 rozmery s\u00fa ide\u00e1lne aj pre funkciu stohovania na doske plo\u0161n\u00fdch spojov.<\/span><\/p>\n

Vzh\u013eadom na \u0161pecifick\u00e9 pou\u017eitie m\u00e9di\u00ed na pripojenie je d\u00f4le\u017eit\u00e9 zoh\u013eadni\u0165 nieko\u013eko bodov po\u010das:
– <\/span>f\u00e1zy n\u00e1vrhu – ke\u010f sa vyber\u00e1 m\u00e9dium
– <\/span>v\u00fdroby – ke\u010f sa vykon\u00e1va ukon\u010denie
– <\/span>kone\u010dn\u00e9ho pou\u017eitia – ke\u010f je m\u00e9dium pripojen\u00e9 k re\u00e1lnej aplik\u00e1cii<\/span><\/p>\n

Ako bolo uveden\u00e9 na za\u010diatku tohto \u010dl\u00e1nku, cie\u013eom je \u010do najviac pribl\u00ed\u017ei\u0165 vl\u00e1kno k SoC. To znamen\u00e1, \u017ee vzdialenosti, na ktor\u00fdch sa realizuj\u00fa skuto\u010dn\u00e9 optick\u00e9 pripojenia, musia by\u0165 \u010do najkrat\u0161ie v porovnan\u00ed s typick\u00fdmi zv\u00e4zkami pou\u017e\u00edvan\u00fdmi na pripojenie modulov QSFP alebo SFP. Z tohto d\u00f4vodu s\u00fa na presnos\u0165 kone\u010dnej d\u013a\u017eky kladen\u00e9 pr\u00edsnej\u0161ie po\u017eiadavky, preto\u017ee vo vn\u00fatri zariadenia nie je priestor na vo\u013en\u00e9 vl\u00e1kna. Modul OBO a rozhranie vonkaj\u0161ieho prostredia maj\u00fa presne definovan\u00fa polohu. Preto je pr\u00edpustn\u00e1 tolerancia d\u013a\u017eky postroja len nieko\u013eko milimetrov. Je d\u00f4le\u017eit\u00e9 nastavi\u0165 kontrolu krit\u00e9ri\u00ed kvality tak, aby sp\u013a\u0148ala t\u00fato n\u00e1ro\u010dn\u00fa po\u017eiadavku. Dod\u00e1vate\u013e tak\u00e9hoto zv\u00e4zku mus\u00ed venova\u0165 ve\u013ek\u00fa pozornos\u0165 v\u00fd\u0165a\u017enosti kvality v\u00fdrobn\u00e9ho procesu, aby udr\u017eal mieru zmetkov\/prepracovania na primeranej kvalitat\u00edvnej \u00farovni, ktor\u00e1 nem\u00e1 vplyv na kone\u010dn\u00fa cenu v\u00fdrobku. <\/span><\/p>\n

Typick\u00fdm prepojovac\u00edm m\u00e9diom je p\u00e1skov\u00fd typ k\u00e1bla s v\u00fd\u0161kou iba 250um a \u0161\u00edrkou zodpovedaj\u00facou po\u010dtu vl\u00e1kien a priemeru vl\u00e1kna. P\u00e1sky so \u0161pecifickou schopnos\u0165ou rozdeli\u0165 k\u00e1bel na jednotliv\u00e9 vl\u00e1kna sa naz\u00fdvaj\u00fa PEELABLE ribbons. Tie, ktor\u00e9 s\u00fa neoddelite\u013en\u00e9, s\u00fa NEODDELITE\u013dN\u00c9. NEVODI\u010cOV\u00c9 typy s\u00fa ur\u010den\u00e9 pre aplik\u00e1cie, kde s\u00fa obe strany zv\u00e4zku ukon\u010den\u00e9 viacvl\u00e1knov\u00fdmi konektormi a nie je medzi nimi potrebn\u00e9 \u017eiadne \u0161peci\u00e1lne zapojenie. T\u00e1to verzia je mimoriadne mechanicky stabiln\u00e1 a existuje len zanedbate\u013en\u00e1 pravdepodobnos\u0165, \u017ee by sa vl\u00e1kna po\u010das ukon\u010dovania alebo in\u0161tal\u00e1cie oddelili. <\/span><\/p>\n

Verzia PEELABLE je vhodn\u00e1 pre hybridn\u00e9 zv\u00e4zky s viacvl\u00e1knov\u00fdm typom konektora na jednej strane (pripojen\u00fdm k modulu OBO) a jednovl\u00e1knov\u00fdmi konektormi (MDC, MIL\/AERO) alebo \u0161peci\u00e1lnym dr\u00f4tov\u00fdm viacvl\u00e1knov\u00fdm konektorom na druhej strane. Je d\u00f4le\u017eit\u00e9 informova\u0165 z\u00e1kazn\u00edka o type pou\u017eitej p\u00e1sky; okrem r\u00f4znych sp\u00f4sobov pou\u017eitia konektorov je potrebn\u00e9 zv\u00e1\u017ei\u0165 aj \u010fal\u0161ie kritick\u00e9 body. <\/span><\/p>\n

V pr\u00edpade, \u017ee sa o\u010dak\u00e1va viacn\u00e1sobn\u00e9 oh\u00fdbanie m\u00e9di\u00ed alebo sa vy\u017eaduje zv\u00fd\u0161en\u00e1 ochrana vl\u00e1kien, mal by sa pou\u017ei\u0165 in\u00fd typ k\u00e1bla. Dobr\u00fdm kandid\u00e1tom je verzia s mal\u00fdm okr\u00fahlym pl\u00e1\u0161\u0165om (2,0 alebo 3,0 mm OD) bu\u010f s kevlarov\u00fdm pevnostn\u00fdm prvkom, alebo bez neho. Pri pou\u017e\u00edvan\u00ed tohto k\u00e1bla je potrebn\u00e9 zv\u00e1\u017ei\u0165 postup ribboniz\u00e1cie, ktor\u00fd zmen\u00ed \u0161trukt\u00faru vo\u013en\u00e9ho vl\u00e1kna na \u0161trukt\u00faru p\u00e1sky, ktor\u00e1 je potrebn\u00e1 na proces ukon\u010denia viacer\u00fdch vl\u00e1kien. <\/span><\/p>\n

Po v\u00fdbere m\u00e9di\u00ed a konektorov je mo\u017en\u00e9 vyrobi\u0165 samotn\u00fd zv\u00e4zok. Existuj\u00fa dva z\u00e1kladn\u00e9 typy: PIGTAILED a CONNECTORIZED (pozri
obr\u00e1zok 3). V prvom pr\u00edpade je modul OBO priamo pripojen\u00fd k optick\u00fdm vl\u00e1knam. Druh\u00e1 mo\u017enos\u0165 vyu\u017e\u00edva funkciu \u0161peci\u00e1lnej obj\u00edmky, ktor\u00e1 je k modulu OBO pripojen\u00e1 zvonku. Tento pr\u00edstup pon\u00faka vy\u0161\u0161iu flexibilitu najm\u00e4 pri manipul\u00e1cii s modulom OBO, preto\u017ee doch\u00e1dza k minim\u00e1lnemu po\u0161kodeniu m\u00e9di\u00ed a modul a d\u013a\u017eka kone\u010dn\u00e9ho produktu sa m\u00f4\u017ee l\u00ed\u0161i\u0165 len d\u013a\u017ekou spojovacieho zv\u00e4zku.
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Another important parameter of the media used is its mechanical stability. The cables are sometimes directly terminated into the OBO and represent an essential part of the module. It is crucial to ensure that the module handling\/installation does not cause any impact on the fibres which can lead to the malfunctioning of the module itself. If a NON-PEELABLE ribbon is used, the problem is negligible as the ribbon construction provides the necessary protection. Termination of the PEELABLE version must be set such that the ribbon keeps its integrity and will not separate once the module is\u00a0 installed. Ribbon separation results in scrapping of the whole module, which is much more expensive than the raw cable itself. To prevent such a situation on the customer side, it is imperative to evaluate the module + cable combination according the Telcordia GR468 standard, which defines the Generic Reliability Assurance Requirements for Optoelectronic Devices. In terms of the optical harness, one of the most important aspects is defining the mechanical integrity of the media used\u2013 cable. It is worth mentioning that the Telcordia GR20 raw cable reliability standard has different levels of acceptance criteria than Telcordia GR468 and therefore it is not sufficient to rely only on the information from the cable manufacturer. This point as well should be on the checklist once the design of the system is under development.<\/span><\/p>\n


Parameter concerns<\/span><\/strong><\/p>\n

As already mentioned, the optical interface on the OBO side and on the face plate side can be based on different materials\/solutions. In principle, there are three basic types:
1. Ceramic ferrule \u2013 used in single-fibre optical connectors. This design guarantees real physical contact between two mated fibres.
2. Rectangular thermo-plastic ferrule \u2013 used in multifibre connectors (MPO, MTP\u00ae), which is also designed to ensure physical contact.
3. Special thermo-plastic ferrule which contains an array of lenses. In this case, there is no real physical contact between the fibres and the emitted light must pass two environment changes (ferrule-air and air-ferrule).<\/span><\/p>\n

The selection of the interface\/ferrule has a direct impact on the most important parameter of the optical path \u2013 insertion loss.<\/span><\/p>\n

Using the first two of the above-mentioned ferrules, with real physical contact between fibres, the insertion loss values are on the level of 0.3dB. Such values are the typical ones, industry accepted and sufficient for a majority of applications. A different situation arises in the case of lens-based mated interfaces. Insertion loss values vary between 1.2 and 2.2 dB (depending on the design). For projects which are more sensitive to the overall power budget, an enhanced type of lensed ferrules can be used. Enhancing of geometry accuracy and the application of an anti-reflective layer on the end face of the ferrule improves the insertion loss, reaching a level of 0.6 \u2013 1.0 dB. This way the customer can choose the most suit able version for the particular application. Figure No. 4 shows the difference in the area which is in physical contact during the mating of the two connectors and has a direct impact on the optical parameters.
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During the procurement process of the harness suppliers \u2013 especially the ones offering lens-based ferrule products \u2013 is essential to ask for confirmation of the optical parameters measuring procedure used. As lens-based solutions are not traditional, it is important to consider not only the declared maximum values of insertion loss (given by the ferrule manufacturer) but also the complete method of measurement. In general, this method includes four points:
1. Setup of measured path \u2013 defining the type of measurement (attenuation related to the individual mated interfaces\/ferrules or to complete optical channel).
2. Setting the zero level before the real measurement.
3. Real measurement and value adjustment caused by Fresnel reflections.
4. Comparison of the measured\/adjusted values to the pass\/fail limit ones given either by the customer or the ferrule manufacturer.<\/span><\/p>\n


In a nutshell<\/span><\/strong><\/p>\n

Harnesses dedicated to connect the OBO module with the outside environment may seem to be technically simple at first glance. Despite this assumption, it is important during the definition part of the project to pay sufficient attention to the:
<\/span>\u2022 <\/span>Type of connector\/interface used on the OBO side and on the outside environment border.
<\/span>\u2022 <\/span>Construction of the interconnection cable used, with an empasis on the quality criteria defined by international standards.
<\/span>\u2022 <\/span>Expected levels of optical parameters with regard to the measuring setup\/procedure used. <\/span><\/p>\n


Complying with these basic points put you in a good position to ensure the future functionality of even the most sophisticated products, such as <\/span>shuffles<\/span>, and prevent any potential quality issues which could appear once the system is in service \u2013 when it can be too late. With Sylex you can count on a simple fact \u2013 that we will do everything to identify all the necessary inputs to give you a perfect output. <\/span><\/p>\n

Sylex is a company which has been active in the fibre optic industry since 1995, offering its experience and professional approach to be the right partner for cases where on-board optic interconnection solutions are required.
<\/span>

Eduard Koza, <\/b>R&D Manager<\/b>, Contact<\/a><\/p>\n

Eduard Koza is R&D manager at Sylex. He started as a project engineer for high-performance copper harnesses. In 2000, he widened his activities to passive fiber optic interconnection products and fiber optic sensing systems. At the beginning of this period, he mainly led multiple technology transfers and covered the implementation of new products into the company portfolio.<\/span><\/p>\n


Later, he held the role of Engineering manager in the company and headed the technology and engineering activities responsible for transferring customer ideas to the final products. His current position covers the management of newly introduced technical solutions, utilizing his consultancy skills related to customized fiber optic interconnection products.<\/span><\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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\n\t\t\t\t\t\n\t\t\t\t\t\t\n\t\t\t\t\t\t\n\t\t\t\t<\/i>\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\tDownload<\/span>\n\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/a>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"

Vl\u00e1kna s\u00fa \u010doraz bli\u017e\u0161ie k \u010dipovej s\u00faprave. Jedn\u00fdm z hlavn\u00fdch cie\u013eov projektantov architekt\u00fary je privies\u0165 \u00fadaje pomocou svetla do bodu, v ktorom sa centr\u00e1lne sprac\u00favaj\u00fa. Ak\u00e9 s\u00fa v s\u00fa\u010dasnosti mo\u017enosti? Ktor\u00e9 typy m\u00e9di\u00ed s\u00fa k dispoz\u00edcii? Na \u010do sa treba zamera\u0165 pri h\u013eadan\u00ed rie\u0161enia prepojenia? V tomto \u010dl\u00e1nku n\u00e1jdete odpovede na tieto ot\u00e1zky,<\/p>\n","protected":false},"author":3,"featured_media":11867,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[543,375],"tags":[537],"class_list":["post-14902","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog-sk","category-uncategorized-sk","tag-produkty-a-riesenia"],"acf":[],"yoast_head":"\nPalubn\u00e1 optika - ako je pripojen\u00e1 k vonkaj\u0161iemu svetu - Sylex<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.sylex.sk\/sk\/palubna-optika-ako-je-pripojena-k-vonkajsiemu-svetu\/\" \/>\n<meta property=\"og:locale\" content=\"sk_SK\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Palubn\u00e1 optika - ako je pripojen\u00e1 k vonkaj\u0161iemu svetu - Sylex\" \/>\n<meta property=\"og:description\" content=\"Vl\u00e1kna s\u00fa \u010doraz bli\u017e\u0161ie k \u010dipovej s\u00faprave. Jedn\u00fdm z hlavn\u00fdch cie\u013eov projektantov architekt\u00fary je privies\u0165 \u00fadaje pomocou svetla do bodu, v ktorom sa centr\u00e1lne sprac\u00favaj\u00fa. Ak\u00e9 s\u00fa v s\u00fa\u010dasnosti mo\u017enosti? Ktor\u00e9 typy m\u00e9di\u00ed s\u00fa k dispoz\u00edcii? Na \u010do sa treba zamera\u0165 pri h\u013eadan\u00ed rie\u0161enia prepojenia? 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