We are pleased to introduce a new addition to our high-performance interconnect portfolio – MT multi-fiber assemblies built with 80 µm reduced-cladding fibers. This technology enables significantly higher fiber density while maintaining excellent optical performance and mechanical stability. 

Our 80µm MT assemblies are ideal for applications where space is limited and tight routing is required, as the reduced fiber diameter allows for smaller bending radii without compromising performance. 

These assemblies are designed for advanced applications where space, performance, and integration flexibility are critical – including AI accelerators, silicon photonics, optical compute engines and high-density board-level interconnects. 

With this new capability, SYLEX continues to support next-generation photonic and HPC architectures that demand compact, precise, and scalable fiber-optic solutions. 

If you are working on a project that requires higher-density MT interfaces or customized fiber-array configurations, our team will be glad to support you at sales@sylex.sk